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Louisiana Tech Faculty Information Page

O’Neal, Dr., Chad B.

Assistant Professor, Mechanical Engineering, Institute for Micromanufacturing (IfM)

Degrees

Ph.D.-Microelectronics-Photonics: University of Arkansas, Fayetteville
MSME-Mechanical Engineering: University of Arkansas, Fayetteville
BSME-Mechanical Engineering: University of Arkansas, Fayetteville

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Contact Info

Areas of Specialization

Research Areas/Interests

• Our group focuses on microenergy devices and processes that utilize silicon and microfabrication techniques such as MEMS (surface and bulk micromachining), thin film deposition and patterning, and wafer-level bonding. We are trying to find to develop high-density, small volume power sources for use in remote, wireless sensors, portable electronics, and other applications.

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Publications

• Patents (3 pending)
  - Apparatus & Method for Nanoscale and Microscale Mechanical Machining and Processing, A.P. Malshe, C.B. O’Neal, US patent pending 01/03/2002, PCT filed 08/25/2003.
  - Miniature Sealed Cavity Optical Package, R.B. Foster, A.P. Malshe, C.B. O’Neal, US patent pending 01/24/2003.
  - Novel Design and Process for RF MEMS and Related Device Packaging, A.P. Malshe, L.W. Schaper, C.B. O’Neal, US patent pending 11/07/2001, PCT filed 11/06/02.


• Selected Journal Publications
  - C.B. O’Neal, K. Virwani, N. Joshi, A.P. Malshe, “Design, Fabrication, and Geometric Error Analysis of a Nanomechanical Machining System for a Nano-Fab Lab-on-a-Chip”, IOP’s Journal of Smart Materials and Structures, to be submitted.
  - C.B. O’Neal, A.P. Malshe, Novel MEMS-based Nanomechanical Machining System on a Chip, Journal of Microelectromechanical systems, to be submitted.
  - C.B. O’Neal, A.P. Malshe, Enabling Technology for Mechanical Machining at the Nanometer Scale, Journal of Manufacturing Science and Engineering, to be submitted.
  - C.B. O'Neal, A.P. Malshe, W.F.. Schmidt, M.H. Gordon, R.R. Reynolds, W.D. Brown, and W.P. Eaton, "A Study of the Effects of Packaging-Induced Stress on the Reliability of the Sandia MEMS Microengine", IEEE Journal of Advanced Packaging, Submitted May 2004.
  - A.P. Malshe, C.B. O’Neal, S.B. Singh, W.D. Brown, W.P.Eaton, W.M. Miller, “Challenges in the Packaging of MEMS, International Journal of Microcircuits and Electronic Packaging, vol. 22, no. 3, pp.233-241, 1999.
• Selected Conferences Publications
  - D. Spencer, A.P. Malshe, R.B. Foster, C.B. O’Neal, “Novel Method for Wafer-Scale Packaging of Opto-electronic Devices:, IMAPS 2003, Boston, November 2003.
  - C. O'Neal, N. Joshi, A.P. Malshe, et al, "Geometric Error Assessment and Related Fabrication of a Nanomechanical Drill, "New Developments in Thermal Aspects of Material Removal Processes, Oklahoma State University, June 10-12, 2003, pp. 85-91.
  - C.B. O’Neal, A.P. Malshe, K. Virwani, W.F. Schmidt, “Design Consideration, Process and Mechanical Modeling, and Tolerance Analysis of a MEMS-based Mechanical Machining System-on-a-Chip (SOAC) for NanoManufacturing”, Proceedings of IMECE 2002: ASME International Mechanical Engineering Congress and Exposition November 17-22, 2002 New Orleans, LA.
  - A.P. Malshe and C.B. O’Neal, “Wafer-level and Chip-scale Packaging of MEMS and Related Microsystems”, MEMS and Related Microsystems Advanced Technology Workshop, sponsored by IMAPS, Scotts Valley, CA (November 2001).
  - A.P. Malshe, Y. Tao, C.B. O’Neal, W.D. Brown, S. Singh and M.H. Gordon, “Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined MEMS (sm-MEMS) Devices”, EPDT-NSF Conference, Fayetteville, AR (September 2001).
  - A.P. Malshe, C.B. O'Neal, S. Singh, Y. Tao, R. Cragan, and W. D. Brown, "Packaging and integration of MEMS and related microsystems for system-on-a-package (SOP)", Proceedings of the SPIE 2000 Symposium on Smart Materials and MEMS, Vol. 4235, pp. 198-208, 2001. (INVITED)
  - C.B. O’Neal, A.P. Malshe, W.F. Schmidt, M.H. Gordon, R.R. Reynolds, W.D. Brown, W.P. Eaton, W.M. Miller, “A Study of the Effects of Packaging Induced Stress on the Reliability of the Sandia MEMS Microengine”, InterPack 2001, July 2001, #15668, Kauai, Hawaii.
  - A.P. Malshe, S.S. Singh, K. Hankins, J.J. Young, B.S. Park, S.N. Yedave, W.D. Brown, “Effects of Packaging Process Steps on the Functionality of MEMS Devices: Investigation of Electrical Interconnection on Lubricated MEMS”, 2000 International Symposium on Microelectronics, 2000.
  - C.B. O’Neal, A.P. Malshe, W.F. Schmidt, R.R. Reynolds, M.H. Gordon, and W.D. Brown, Investigation of Effects of Die Attachment on MEMS Functionality: Lessons Learned, IMAPS Advanced Technology Workshop on Packaging and Integration of MEMS & Related Microsystems, Orlando, Florida, November 10-12, 2000.
  - C.B. O’Neal, A.P. Malshe, W.P. Eaton, “Effect of Storage Life and Drive Signals on the Reliability of the Sandia Microengine”, MEMS Reliability for Critical Applications, SPIE Proceedings, Santa Clara, CA, September 18-20, 2000, Vol.4180 , pp.123-132.
  - C.B. O’Neal, A.P. Malshe, MEMS Packaging at the University of Arkansas, TEX_MEMS ‘99, College Station, TX , August 24, 1999.
  - C.B. O’Neal, Sandia Microengine Reliability Study, Sandia Student Symposium, August 5, 1999.
  - C.B. O’Neal, A.P. Malshe, S.B. Singh, W.D. Brown, W.P.Eaton, Challenges in the Packaging of MEMS, Proceedings of the 1999 International Symposium on Advanced Packaging Materials, Braselton, GA, March 14-17, pp.41-47.<
  

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